Fabrication of microfluidic channels and texturing of medical implants.

Shaping heat-sensitive components and thin-walled aluminum parts prone to distortion.

Dicing microelectronic wafers and machining piezoelectric materials without risk of electrical shorts between layers.

This process uses a high-velocity stream of water mixed with fine abrasive particles (typically garnet) to erode material at a microscopic level. Recent advancements in (with diameters as small as 0.2 mm or 0.3 mm) allow for the milling of narrow, controlled-depth channels. Why it’s a Game-Changer for Micro-Channels

The erosion rate is not constant; it typically decreases as the channel gets deeper. Specialized models are used to predict the final topography for deep channels.

The small jet size allows for omnidirectional cutting and intricate patterns with radii as small as 0.1 mm.

The mechanical erosion process leaves a clean surface without the recast layers often found in wire EDM or laser cutting. Key Technical Insights